TARJETA MADRE

MB ASUS B760 INTEL S-1700 13A GEN / 4X DDR5 5000 / DP / HDMI / M.2 / 5X USB 3.2 / USB-C / WIFI 6 / BLUETOOTH / ATX / GAMA MEDIA / GAMER / RGB ASUS OEM TUF GAMING B760-PLUS WIFI

$4,713 MXN

Precio en Pesos Mexicanos

Existencia: 4 Código: MB-1253

Número de Parte: TUF GAMING B760-PLUS WIFI

Ficha Técnica

Garantia: 3 ANIOS

CPU
INTEL SOCKET LGA1700 FOR 13TH GEN INTEL CORE AND 12TH GEN INTEL CORE, PENTIUM GOLD AND CELERON PROCESSORS*
SUPPORTS INTEL TURBO BOOST TECHNOLOGY 2.0 AND INTEL TURBO BOOST MAX TECHNOLOGY 3.0
* REFER TO WWW.ASUS.COM FOR CPU SUPPORT LIST.
** INTEL TURBO BOOST MAX TECHNOLOGY 3.0 SUPPORT DEPENDS ON THE CPU TYPES.

CHIPSET
INTEL B760 CHIPSET

MEMORY
4 X DIMM, MAX. 128GB, DDR5 7200(OC)/7000(OC)/6800(OC)/6600(OC)/6400(OC)/ 6200(OC)/ 6000(OC)/ 5800(OC)/ 5600/ 5400/5200/ 5000/ 4800 NON-ECC, UN-BUFFERED MEMORY*
DUAL CHANNEL MEMORY ARCHITECTURE
SUPPORTS INTEL EXTREME MEMORY PROFILE (XMP)
OPTIMEM II
* SUPPORTED MEMORY TYPES, DATA RATE (SPEED), AND NUMBER OF DRAM MODULES VARY DEPENDING ON THE CPU AND MEMORY CONFIGURATION, FOR MORE INFORMATION PLEASE REFER TO CPU/MEMORY SUPPORT UNDER THE SUPPORT TAB OR VISIT HTTPS://WWW.ASUS.COM/SUPPORT/
* NON-ECC, UN-BUFFERED DDR5 MEMORY SUPPORTS ON-DIE ECC FUNCTION.

GRAPHICS
1 X DISPLAYPORT
1 X HDMITM PORT
GRAPHICS SPECIFICATIONS MAY VARY BETWEEN CPU TYPES. PLEASE REFER TO WWW.INTEL.COM FOR ANY UPDATES.
SUPPORTS MAX. 4K@60HZ AS SPECIFIED IN DISPLAYPORT 1.4.
SUPPORTS 4K@60HZ AS SPECIFIED IN HDMITM 2.1.

EXPANSION SLOTS
INTEL 13TH AND 12TH GEN PROCESSORS
1 X PCIE 5.0 X16 SLOT
INTEL B760 CHIPSET
1 X PCIE 3.0 X16 SLOT (SUPPORTS X4 MODE)*
2 X PCIE 3.0 X1 SLOTS*
* PCIEX16(G3) SHARES BANDWIDTH WITH PCIEX1(G3)_1 AND PCIEX1(G3)_2 . WHEN PCIEX1(G3)_1 OR PCIEX1(G3)_2 RUNS AT PCIE X1 MODE, PCIEX16(G3) WILL ONLY RUN AT PCIE X2 MODE.
- TO ENSURE COMPATIBILITY OF THE DEVICE INSTALLED, PLEASE REFER TO HTTPS://WWW.ASUS.COM/SUPPORT/ FOR THE LIST OF SUPPORTED PERIPHERALS.

STORAGE
TOTAL SUPPORTS 3 X M.2 SLOTS AND 4 X SATA 6GB/S PORTS*
INTEL 13TH AND 12TH GEN PROCESSORS
M.2_1 SLOT (KEY M), TYPE 2242/2260/2280 (SUPPORTS PCIE 4.0 X4 MODE)
INTEL B760 CHIPSET
M.2_2 SLOT (KEY M), TYPE 2242/2260/2280/22110 (SUPPORTS PCIE 4.0 X4 MODE)
M.2_3 SLOT (KEY M), TYPE 2242/2260/2280 (SUPPORTS PCIE 4.0 X4 MODE)
4 X SATA 6GB/S PORTS
* INTEL RAPID STORAGE TECHNOLOGY SUPPORTS SATA RAID 0/1/5/10.

ETHERNET
1 X REALTEK 2.5GB ETHERNET
TUF LANGUARD
WIRELESS AND BLUETOOTH
WI-FI 6
2X2 WI-FI 6 (802.11 A/B/G/N/AC/AX)
SUPPORTS 2.4/5GHZ FREQUENCY BAND

BLUETOOTH V5.2
*THE BLUETOOTH VERSION MAY VARY, PLEASE REFER TO THE WI-FI MODULE MANUFACTURERS WEBSITE FOR THE LATEST SPECIFICATIONS.

USB
REAR USB (TOTAL 6 PORTS)
1 X USB 3.2 GEN 2X2 PORT (1 X USB TYPE-C)
1 X USB 3.2 GEN 2 PORT (1 X TYPE-A)
3 X USB 3.2 GEN 1 PORTS (3 X TYPE-A)
1 X USB 2.0 PORT (1 X TYPE-A)
FRONT USB (TOTAL 7 PORTS)
1 X USB 3.2 GEN 2 CONNECTOR (SUPPORTS USB TYPE-C)
1 X USB 3.2 GEN 1 HEADER SUPPORTS 2 ADDITIONAL USB 3.2 GEN 1 PORTS
2 X USB 2.0 HEADERS SUPPORT 4 ADDITIONAL USB 2.0 PORTS

AUDIO
REALTEK 7.1 SURROUND SOUND HIGH DEFINITION AUDIO CODEC
- SUPPORTS: JACK-DETECTION, MULTI-STREAMING, FRONT PANEL JACK-RETASKING
- SUPPORTS UP TO 24-BIT/192 KHZ PLAYBACK
AUDIO FEATURES
- AUDIO SHIELDING
- REAR OPTICAL S/PDIF OUT PORT
- PREMIUM AUDIO CAPACITORS
- DEDICATED AUDIO PCB LAYERS
- AUDIO COVER

BACK PANEL I/O PORTS
1 X USB 3.2 GEN 2X2 PORT (1 X USB TYPE-C®)
1 X USB 3.2 GEN 2 PORT (1 X TYPE-A)
3 X USB 3.2 GEN 1 PORTS (3 X TYPE-A)
1 X USB 2.0 PORT (1 X TYPE-A)
1 X DISPLAYPORT
1 X HDMITM PORT
1 X WI-FI MODULE
1 X REALTEK 2.5GB ETHERNET PORT
5 X AUDIO JACKS
1 X OPTICAL S/PDIF OUT PORT
INTERNAL I/O CONNECTORS
FAN AND COOLING RELATED
1 X 4-PIN CPU FAN HEADER
1 X 4-PIN CPU OPT FAN HEADER
1 X 4-PIN AIO PUMP HEADER
4 X 4-PIN CHASSIS FAN HEADERS
POWER RELATED
1 X 24-PIN MAIN POWER CONNECTOR
1 X 8-PIN +12V POWER CONNECTOR
1 X 4-PIN +12V POWER CONNECTOR
STORAGE RELATED
3 X M.2 SLOTS (KEY M)
4 X SATA 6GB/S PORTS

USB
1 X USB 3.2 GEN 2 CONNECTOR (SUPPORTS USB TYPE-C® )
1 X USB 3.2 GEN 1 HEADER SUPPORTS 2 ADDITIONAL USB 3.2 GEN 1 PORTS
2 X USB 2.0 HEADERS SUPPORT 4 ADDITIONAL USB 2.0 PORTS
MISCELLANEOUS
3 X ADDRESSABLE GEN 2 HEADERS
1 X AURA RGB HEADER
1 X CLEAR CMOS HEADER
1 X COM PORT HEADER
1 X FRONT PANEL AUDIO HEADER (AAFP)
1 X 20-3 PIN SYSTEM PANEL HEADER WITH CHASSIS INTRUDE FUNCTION
1 X THUNDERBOLT (USB4) HEADER
SPECIAL FEATURES
ASUS TUF PROTECTION
- DIGI+ VRM (- DIGITAL POWER DESIGN WITH DRMOS)
- ESD GUARDS
- TUF LANGUARD
- OVERVOLTAGE PROTECTION
- SAFESLOT CORE+
- STAINLESS-STEEL BACK I/O
ASUS Q-DESIGN
- M.2 Q-LATCH
- Q-DIMM
- Q-LED (CPU [RED], DRAM [YELLOW], VGA [WHITE], BOOT DEVICE [YELLOW GREEN])
- Q-SLOT
ASUS THERMAL SOLUTION
- M.2 HEATSINK
- VRM HEATSINK DESIGN
ASUS EZ DIY
- CPU SOCKET LEVER PROTECTOR
- PROCOOL
- PRE-MOUNTED I/O SHIELD
- SAFESLOT CORE+
- SAFEDIMM

AURA SYNC
- AURA RGB HEADER
- ADDRESSABLE GEN 2 HEADERS
SOFTWARE FEATURES
ASUS EXCLUSIVE SOFTWARE
ARMOURY CRATE
- AURA CREATOR
- AURA SYNC
- FAN XPERT 4
- POWER SAVING
- TWO-WAY AI NOISE CANCELLATION
AI SUITE 3
- DIGI+ VRM
- PC CLEANER
TUF GAMING CPU-Z
DTS AUDIO PROCESSING
MYASUS
NORTON 360 FOR GAMERS
WINRAR
UEFI BIOS
ASUS EZ DIY
- ASUS CRASHFREE BIOS 3
- ASUS EZ FLASH 3
- ASUS UEFI BIOS EZ MODE

BIOS
128 MB FLASH ROM, UEFI AMI BIOS
MANAGEABILITY
WOL BY PME, PXE

ACCESSORIES
CABLES
2 X SATA 6GB/S CABLES
MISCELLANEOUS
1 X ASUS WI-FI MOVING ANTENNA
1 X TUF GAMING STICKER
2 X M.2 RUBBER PACKAGES
1 X SCREW PACKAGE FOR M.2 SSD
DOCUMENTATION
1 X TUF CERTIFICATION CARD
1 X USER GUIDEOPERATING SYSTEM
WINDOWS 11, WINDOWS 10 64-BIT

FORM FACTOR
ATX FORM FACTOR
12 INCH X 9.6 INCH ( 30.5 CM X 24.4 CM )

Ficha Comercial

MOTHERBOARD INTEL B760 (LGA 1700) ATX CON PUERTO PCIE 5.0, DDR5, TRES PUERTOS PCIE 4.0 M.2, 12+1 DRMOS, REALTEK 2.5GB ETHERNET, DISPLAYPORT, HDMI, USB FRONTAL 3.2 GEN 2 TIPO-C?, AURA SYNC, AEMP II



SOCKET INTEL LGA 1700: LISTO PARA PROCESADORES INTEL DE 13A Y 12A GENERACION.

SOLUCION DE ENERGIA MEJORADA: 12+1 DRMOS, PCB DE SEIS CAPAS, CONECTORES PROCOOL, CHOKES DE ALEACION Y CAPACITORES DURADEROS PARA UNA ENTREGA DE ENERGIA ESTABLE Y ULTILIDAD FAN XPERT 4.

ENFRIAMIENTO COMPLETO: DISIPADOR DE CALOR VRM GRANDE, DISIPADORES DE CALOR M.2, DISIPADOR DE CALOR PCH, PUERTOS PARA VENTILADOR HIBRIDO Y FAN XPERT 2+.

CONECTIVIDAD MAS RECIENTE: PUERTO PCIE 5.0, PUERTOS PCIE 4.0 M.2, USB 3.2 GEN 2X2 TYPE-C POSTERIOR, PUERTO PARA PANEL FRONTAL USB 3.2 GEN 2 TYPE-C; Y COMPATIBILIDAD CON THUNDERBOLT 4(USB4).

CANCELACION DE RUIDO DE IA BIDIRECCIONAL: REDUCE EL RUIDO DE FONDO DEL MICR?FONO Y LA SALIDA DE AUDIO PARA UNA COMUNICACION N?TIDA EN JUEGOS O VIDEOCONFERENCIAS.